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TS8388BCFS Scheda tecnica(PDF) 47 Page - ATMEL Corporation |
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TS8388BCFS Scheda tecnica(HTML) 47 Page - ATMEL Corporation |
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47 / 57 page  47 TS8388B 2144C–BDC–04/03 Enhanced CQFP68 Thermal Characteristics Enhanced CQFP68 The CQFP68 has been modified, in order to improve the thermal characteristics: • A CuW heatspreader has been added at the bottom of the package. • The die has been electrically isolated with the ALN substrate. Thermal Resistance from Junction to Case: RTHJC Typical value for Rthjc is given to 1.56 °C/W. This value does not include thermal contact resistance between package and external compo- nent (heatsink or PCBoard). As an example, 2.0 °C/W can be taken for 50 µm of thermal grease. Heatsink It is recommended to use an external heatsink, or PCBoard special design. The stand off has been calculated to permit the simultaneous soldering of the leads and of the heatspreader with the solder paste. Figure 52. Enhanced CQFP68 Suggested Assembly Cooling system efficiency can be monitored using the Temperature Sensing Diode, integrated in the device. Printed circuit board CuW heatspreader 28.78 Thermal via Solid ground plane 24.13 |
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