2.5 ± 0.2

(.098 ± .008)

2.0 ± 0.2

(.079 ± .008)

2.0

(.079)

0.6 ± 0.3

(.024 + .012)

0.6 ± 0.3

(.024 + .012)

1.0

(.039)

MAX.

2.8

(.110)

1.2

(.047)

Features

n

Wirewound

n

Shieldedconstruction

n

Metalalloypowdercore

n

Highsaturationcurrent

n

Lowprofile

n

AEC-Q200qualified

n

RoHScompliant*andhalogenfree**

Applications

n

Automotivesystems:

-Driverassistant

-Lighting

-Infotainment

n

DC/DCconverters

n

Powersupplies

n

Smartphones

n

HDD/SSD

n

Miniaturemobileelectronicdevices

SRP2510ASeries-ShieldedPowerInductors

Operating Temperature...-40 °C to +125 °C

(Temperature rise included)

Storage Temperature (Component)

....................................-50 °C to +125 °C

Rated Current

................ Inductance drops 30 % at Isat

Temperature Rise .........40 °C at rated Irms

Moisture Sensitivity Level (MSL) ..............1

ESD Classification (HBM).......................3B

Electrical Specifications @ 25 °C

General Specifications

Core..............................Metal alloy powder

Wire ................................Enameled copper

Terminal Finish .......................................Sn

Packaging........... 3000 pcs. per 7-inch reel

Materials

Recommended Layout

DIMENSIONS:

MM

(INCHES)

*RoHSDirective2002/95/ECJan.27,2003includingannexandRoHSRecast2011/65/EUJune8,2011.

**Bournsconsidersaproducttobe“halogenfree”if(a)theBromine(Br)contentis900ppmorless;(b)theChlorine

(Cl)contentis900ppmorless;and(c)thetotalBromine(Br)andChlorine(Cl)contentis1500ppmorless.

Specificationsaresubjecttochangewithoutnotice.

Thedevicecharacteristicsandparametersinthisdatasheetcananddovaryindifferentapplicationsandactualdevice

performancemayvaryovertime.

Usersshouldverifyactualdeviceperformanceintheirspecificapplications.

Bourns

Part Number

Inductance

@ 1 MHz

/ 1 V

Q (Typ.)

@1 MHz /

1 V

SRF

(MHz)

Typ.

DCR

(mW)

Typ.

DCR

(mW)

Max.

Irms

(A)

Typ.

Isat

(A)

Typ.

L

(µH)

Tol.

(%)

SRP2510A-R22M 0.22 ±20

35

170

9

12.5

5.9

7.9

SRP2510A-R33M 0.33 ±20

35

170

21

26

4.4

6.6

SRP2510A-R47M 0.47 ±20

35

138

27

32

3.9

5.0

SRP2510A-R68M 0.68 ±20

35

120

37

44

3.4

4.3

SRP2510A-1R0M 1.0

±20

35

94

45

54

3.0

3.5

SRP2510A-1R5M 1.5

±20

35

68

76

91

2.5

2.6

SRP2510A-2R2M 2.2

±20

35

57

99

119

2.3

2.4

SRP2510A-4R7M 4.7

±20

35

40

220

262

1.36

1.8

Product Dimensions

Electrical Schematic

Soldering Profile

t

25 °C to Peak

ts

Preheat

tL

tp

25

TL

Tp

Time (Seconds)

RAMP-DOWN

RAMP-UP

Tsmax

Tsmin

CRITICAL

ZONE

TL to TP

Profile Feature

Pb Free Assembly

Average Ramp Rate (TSmax to TP)

3 °C/second max.

Preheat

- Temperature Min. (TSmin)

- Temperature Max. (TSmax)

- Time (tsmin to tsmax)

150 °C

200 °C

60-180 seconds

Time Maintained Above

- Temperature (TL)

- Time (tL)

217 °C

60-150 seconds

Peak Temperature (Tp)

260 °C +0/-5 °C

Time within 5 °C of Actual Peak Temperature

(Tp)

20-40 seconds

Ramp-Down Rate

6 °C/second max.

Time 25 °C to Peak Temperature

8 minutes max.

4.5

(.177)

1.5

(.060)

2.5

(.099)

2.5 ± 0.2

(.098 ± .008)

2.0 ± 0.2

(.079 ± .008)

2.0

(.079)

0.6 ± 0.3

(.024 + .012)

0.6 ± 0.3

(.024 + .012)

1.0

(.039)

MAX.

2.8

(.110)

1.2

(.047)

How to Order

SRP2510A - R22M

Model

Value Code (see table)