HSMS282X datasheet(1/14 Pages) HP

Il numero della parte	HSMS282X

Spiegazioni elettronici	Surface Mount RF Schottky Barrier Diodes

PDF	14 Pages

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Produttore elettronici	HP [Agilent(Hewlett-Packard)]

Homepage	http://www.home.agilent.com

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Surface Mount RF Schottky

Barrier Diodes

Technical Data

HSMS-282x Series

Features

• Low Turn-On Voltage

(As Low as 0.34 V at 1 mA)

• Low FIT (Failure in Time)

Rate*

• Six-sigma Quality Level

• Single, Dual and Quad

Versions

• Unique Configurations in

Surface Mount SOT-363

Package

– increase flexibility

– save board space

– reduce cost

• HSMS-282K Grounded

Center Leads Provide up to

10 dB Higher Isolation

• Matched Diodes for

Consistent Performance

• Better Thermal Conductivity

for Higher Power Dissipation

*

For more information see the

Surface Mount Schottky Reliability

Data Sheet.

Description/Applications

These Schottky diodes are

specifically designed for both

analog and digital applications.

This series offers a wide range of

specifications and package

configurations to give the

designer wide flexibility. Typical

applications of these Schottky

diodes are mixing, detecting,

switching, sampling, clamping,

and wave shaping. The

HSMS-282x series of diodes is the

Package Lead Code Identification, SOT-23/SOT-143

(Top View)

COMMON

CATHODE

#4

UNCONNECTED

PAIR

#5

COMMON

ANODE

#3

SERIES

#2

SINGLE

#0

12

3

12

34

RING

QUAD

#7

12

34

BRIDGE

QUAD

#8

12

34

CROSS-OVER

QUAD

#9

12

34

12

3

12

3

12

3

Package Lead Code

Identification, SOT-323

(Top View)

Package Lead Code

Identification, SOT-363

(Top View)

COMMON

CATHODE

F

COMMON

ANODE

E

SERIES

C

SINGLE

B

COMMON

CATHODE QUAD

M

UNCONNECTED

TRIO

L

BRIDGE

QUAD

P

COMMON

ANODE QUAD

N

RING

QUAD

R

12

3

65

4

HIGH ISOLATION

UNCONNECTED PAIR

K

12

3

65

4

12

3

65

4

12

3

65

4

12

3

65

4

12

3

65

4

best all-around choice for most

applications, featuring low series

resistance, low forward voltage at

all current levels and good RF

characteristics.

Note that Agilent’s manufacturing

techniques assure that dice found

in pairs and quads are taken from

adjacent sites on the wafer,

assuring the highest degree of

match.

88759/02-5.PM6.0J

2001.04.25, 6:40 PM

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