NOTES: UNLESS OTHERWISE SPECIFIED

1. EPOXY COATING

2. FOR SOLDER BUMP COMPOSITION, SEE “SOLDER INFORMATION” IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB

(www.national.com).

3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.

4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.

5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS

PACKAGE HEIGHT.

REFERENCE JEDEC REGISTRATION MO-211, VARIATION DD.

8-Bump micro SMD

NS Package Number TLA08AAA

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves

the right at any time without notice to change said circuitry and specifications.

For the most current product information visit us at www.national.com.

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS

WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR

CORPORATION. As used herein:

1. Life support devices or systems are devices or systems

which, (a) are intended for surgical implant into the body, or

(b) support or sustain life, and whose failure to perform when

properly used in accordance with instructions for use

provided in the labeling, can be reasonably expected to result

in a significant injury to the user.

2. A critical component is any component of a life support

device or system whose failure to perform can be reasonably

expected to cause the failure of the life support device or

system, or to affect its safety or effectiveness.

BANNED SUBSTANCE COMPLIANCE

National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship

Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned

Substances’’ as defined in CSP-9-111S2.

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