9629-1/15

Phone: +1.315.655.8710 | Email: DLISales@knowles.com | www.dilabs.com

Soldering Information

DLI solderable components are compatible with both

SnPb and 100% Sn mounting methods. Unless otherwise

specified, component termination metal is Ni/Au. Gold

layer is less than 6 micro-inch to eliminate any Au

embrittlement concern. A detailed application note is

available at dilabs.com.

Use of Silver Loaded Epoxy Adhesives

Use of conductive epoxy in place of solders is not

recommended on our solder surface mountable

components. Isolation must be maintained between the

ground plane and signal traces when mounted on PCB.

Epoxy may bleed out and degrade performance.

Board Layout Design (SMT)

Board layout for each surface mountable device will

require a ground plane with RF I/O traces. Each catalog

part number may require a different PCB pattern

recommendation and the individual datasheet and pattern

recommendation should be reviewed. Devices are designed

for a single ended 50 ohm system unless otherwise stated.

Proper transmission line impedance is required to meet

published electrical specifications.

mil thick material. Components were designed to work with

other board materials when source impedance are matched

to 50Ω. Please contact DLI Applications Engineering with

any questions on use of other RF layer.

See dilabs.com for more detailed application note on board

mounting recommendations.

RoHS

All products are RoHS compliant.

Chip and Wire Information

DLI wire bond devices are designed for silver loaded

epoxy adhesives to ground plane. A wire bond to I/O

pad with thermo compression ball or wedge bonding on

MIL-STD gold thickness (min 50 micro-inch). Device is

also compatible with standard die attach methods but not

compatible with Sn or SnPb solderable methods. Follow

typical microwave wire bonding practices to minimize

added inductance that may adversely impact electrical

performance.

Packaging

Components will be packaged in best standard commercial

practices unless otherwise noted or requested. Packaging

options include bulk and tape and reel.

Handling & Storage

Components should never be handled with fingers;

perspiration and skin oils can inhibit solderability or wire

bond ability and will aggravate cleaning.

Ceramic components should never be handled with metallic

instruments. Metal tweezers should never be used as these

can chip the product and leave abraded metal tracks on

the product surface. Plastic, carbon fiber and plastic coated

metal types are readily available and recommended.

Devices are designed to withstand typical storage

conditions. Devices may be stored between -55°C and

+125°C and in a non-condensing environment.

Taped product should be stored out of direct sunlight, which

might promote deterioration in tape performance.

Product, stored under the conditions recommended above,

in its “as received” packaging, has a minimum shelf life of

2 years.

2 to 18 GHz SM Bandpass Filters

Knowles (Cazenovia)

2777 Route 20 East, Cazenovia, NY 13035