PCN DSG-COM/03/145

Product Family /Commercial Product

STANDARD LINEAR products in SO8 package

Type Of Change

Package assembly process change

Reason For Change

Environmental directive

Description of the change

To remove lead from plating by using

preplating nickel palladium gold leadframe

NiPdAu. This change will not affect

ELECTRICAL & MECHANICAL

parameters. Samples available:

LM393DT/LM358DT. Other samples: on

request. PLEASE BOOK YOUR SAMPLE ORDER IN

NON-STANDARD WITH THE FOLLOWING COMMENT "AS

PER LEADFREE PCN DSG-COM/03/145".

Forecasted date of change

07-May-2003

Forecasted date of samples for customer

07-Feb-2003

Forecasted date for STMicroelectronics change

07-Feb-2003

qualification report availability

Marking to identify changed product

"E" letter on the package close to ST LOGO

Description of qualification program

See Attached Qualification Plan

Product Line(s) and/or Part Number(s)

See Attached List

Manufacturing Location(s)

Estimated Date of first shipment

07-May-2003

Division Product Manager

Jean Claude KAIRE

Date: Jan.29 ,03

Division Q.A. Manager

Francoise PACCARD

Date: Jan.29 ,03

Qualification Plan Denied

Name:

Qualification Plan Approved

Title:

Customer Acknowledgement of Receipt

PCN DSG-COM/03/145

Please sign and return to STMicroelectronics Sales Office

Company:

Change Denied

Date:

Change Approved

Signature:

Remark

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2003/02/7