BeRex

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© 2016 BeRex

Rev. 2.1 A

PRELIMINARY

BCL016B

Frequency = 12GHz

WIRE BONDING INFORMATION

Always follow wire bonding diagrams recommended by BeRex for each device to achieve optimum device

performance and reliability. As a general rule, bonding temperature should be kept to a maximum of 280°C for no

longer than 2 minutes for all bonding wires.

Using 1 mil. Diameter, Au bonding wires.

1. Gate to input transmission line

- Length and Height : 500 µm x 250 µm

- Number of wire(s): 1

2. Drain to output transmission line

- Length and Height : 500 µm x 250 µm

- Number of wire(s) : 1

3. Source to ground plate

- Length and Height : 350 µm x 200 µm

- Number of wire(s) : 4