Rev - 230517

BGA Heat Sink - High Performance

Device Specific - NXP

*Image above is for illustration purpose only.

ATS Part#:

ATS-59002-C1-R0

Description:

25.00 x 32.00 x 13.00 mm BGA Heat Sink - High Performance Device Specific - NXP

Heat Sink Type:

NXP

Heat Sink Attachment:

maxiGRIP

Equivalent Part Number:

Features & Benefits

Designed for flip-chip processors such as NXP MPCs

Comes preassembled with high performance, phase changing, thermal interface material

Thermal Performance

AIR VELOCITY

@200 LFM

1.0 M/S

@300 LFM

1.5 M/S

@400 LFM

2.0 M/S

@500 LFM

2.5 M/S

@600 LFM

3.0 M/S

@700 LFM

3.5 M/S

@800 LFM

4.0 M/S

THERMAL RESISTANCE

Unducted Flow

6.5 °C/W

5 °C/W

4.1 °C/W

3.6 °C/W

3.2 °C/W

3 °C/W

2.7 °C/W

Ducted Flow

3.8

N/A

N/A

N/A

N/A

N/A

N/A

Product Detail

Schematic Image

Dimension A

Dimension B

Dimension C

Dimension D

TIM

Finish

*Image above is for illustration purpose only.

25.00 mm

32.00 mm

13.00 mm

46.5 mm

T766

BLACK-ANODIZED

Notes:

ATS-59002-C2-R0 is the exact heat sink assembly with an equivalent thermal interface material

(Saint Gobain C1100F). NOTE: Saint Gobain C1100F is discontinued effective 12/31/10.

Thermal performance data are provided for reference only. Actual performance may vary by

application.

ATS reserves the right to update or change its products without notice to improve the design or

performance.

ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant.

Contact ATS to learn about custom options available.

For more information, to find a distributor or to place an order, please contact us at

781-769-2800 (North America), sales@qats.com or www.qats.com.