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AD9434

Data Sheet

Rev. B | Page 8 of 28

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Electrical

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to DRGND

−0.3 V to +2.0 V

AGND to DRGND

−0.3 V to +0.3 V

AVDD to DRVDD

−2.0 V to +2.0 V

D0+/D0− Through D11+/D11−

to DRGND

−0.3 V to DRVDD + 0.2 V

DCO+, DCO− to DRGND

−0.3 V to DRVDD + 0.2 V

OR+, OR− to DRGND

−0.3 V to DRVDD + 0.2 V

CLK+ to AGND

−0.3 V to AVDD + 0.2 V

CLK− to AGND

−0.3 V to AVDD + 0.2 V

VIN+ to AGND

−0.3 V to AVDD + 0.4 V

VIN− to AGND

−0.3 V to AVDD + 0.4 V

CML to AGND

−0.3 V to AVDD + 0.2 V

VREF to AGND

−0.3 V to AVDD + 0.2 V

SDIO to DRGND

−0.3 V to DRVDD + 0.2 V

PDWN to AGND

−0.3 V to DRVDD + 0.2 V

CSB to AGND

−0.3 V to DRVDD + 0.2 V

SCLK/DFS to AGND

−0.3 V to DRVDD + 0.2 V

Environmental

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature

(Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

The exposed paddle must be soldered to the ground plane for

the LFCSP package. Soldering the exposed paddle to the PCB

increases the reliability of the solder joints, maximizing the

thermal capability of the package.

Table 6.

Package Type

θJA

θJC

Unit

56-Lead LFCSP_VQ (CP-56-5)

23.7

1.7

°C/W

Typical θJA and θJC are specified for a 4-layer board in still air.

Airflow increases heat dissipation, effectively reducing θJA. In

addition, metal in direct contact with the package leads from

metal traces, through holes, ground, and power planes reduces

the θJA.

ESD CAUTION

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