AD9633 datasheet(12/42 Pages) AD

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Data Sheet

AD9633

Rev. B | Page 11 of 41

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Electrical

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +2.0 V

Digital Outputs (D0±x, D1±x, DCO+,

DCO−, FCO+, FCO−) to AGND

−0.3 V to +2.0 V

CLK+, CLK− to AGND

−0.3 V to +2.0 V

VIN+x, VIN−x to AGND

−0.3 V to +2.0 V

SCLK/DTP, SDIO/OLM, CSB to AGND

−0.3 V to +2.0 V

SYNC, PDWN to AGND

−0.3 V to +2.0 V

RBIAS to AGND

−0.3 V to +2.0 V

VREF, SENSE to AGND

−0.3 V to +2.0 V

Environmental

Operating Temperature Range (Ambient)

−40°C to +85°C

Maximum Junction Temperature

150°C

Lead Temperature (Soldering, 10 sec)

300°C

Storage Temperature Range (Ambient)

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Table 7. Thermal Resistance

Package Type

Air Flow

Velocity

(m/sec)

θJA1

θJB

θJC

Unit

48-Lead LFCSP

0.0

23.7

7.8

7.1

°C/W

7 mm × 7 mm

1.0

20.0

N/A

°C/W

CP-48-13

2.5

18.7

N/A

°C/W

θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad

soldered to PCB.

ESD CAUTION

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