SSM2604 datasheet(27/29 Pages) AD

27 / 29 page

SSM2604

Data Sheet

Rev. A | Page 26 of 28

OUTLINE DIMENSIONS

2.65

2.50 SQ

2.35

3.75

BSC SQ

COMPLIANT

TO JEDEC STANDARDS MO-220-VGGD-1

0.50

BSC

PIN 1

INDICATOR

0.50

0.40

0.30

TOP VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

COPLANARITY

0.08

1.00

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

0.60 MAX

0.25 MIN

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

4.10

4.00 SQ

3.90

EXPOSED

PAD

BOTTOM VIEW

Figure 28. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

(CP-20-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

SSM2604CPZ-REEL

−40°C to +85°C

20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-20-4

SSM2604CPZ-REEL7

−40°C to +85°C

20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-20-4

SSM2604-EVALZ

Evaluation Board

Z = RoHS Compliant Part.

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