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KWDCLMS1.PC Scheda tecnica(PDF) 16 Page - OSRAM GmbH |
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KWDCLMS1.PC Scheda tecnica(HTML) 16 Page - OSRAM GmbH |
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16 / 25 page ![]() 2015-01-19 16 Version 1.1 KW DCLMS1.PC Recommended Solder Pad 8) page 24 Reflow soldering Empfohlenes Lötpaddesign 8) Seite 24 Reflow-Löten Note: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Anm.: Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet. |
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