| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |
Pepperl+Fuchs Inc. |
OBE10M-R3-SE0-L
|
774Kb/4P |
Laser thru-beam sensor
|
|
OBE10M-R3-SE0-P-L
|
1Mb/7P |
Thru-beam sensor (pair)
2023-03-28 |
|
OBE10M-R3-SE1-P-L
|
1Mb/7P |
Thru-beam sensor (pair)
2023-04-04 |
|
OBE10M-R3-SE2-L
|
774Kb/4P |
Laser thru-beam sensor
|
|
OBE10M-R3-SE2-P-L
|
1Mb/7P |
Thru-beam sensor (pair)
2023-03-28 |
|
OBE10M-R3-SE3-P-L
|
1Mb/7P |
Thru-beam sensor (pair)
2023-04-04 |
|
OBE10M-R3-SP1-P-L
|
1Mb/7P |
Thru-beam sensor (pair)
2023-03-28 |
|
OBR50M-R300-2P1-V1
|
322Kb/3P |
Retroreflective sensor
|
|
OBR50M-R300-2PP-V1
|
322Kb/3P |
Retroreflective sensor
|
|
OMR50M-R300-IEP-V1
|
453Kb/4P |
Measuring sensor with multiple switch points
|
|
OMR50M-R300-UEP-V1
|
457Kb/4P |
Measuring sensor with multiple switch points
|
|
OQR50M-R300-2EP-V1
|
399Kb/4P |
Measuring sensor with multiple switch points
|
MPS Industries, Inc. |
R7X1210M-R33
|
160Kb/1P |
ENCAPSULATION MOLDED CHIP INDUCTOR
|
|
R7X1210M-R39
|
160Kb/1P |
ENCAPSULATION MOLDED CHIP INDUCTOR
|
Source Photonics, Inc. |
T-11-1250M-R3-MFC
|
397Kb/3P |
1.25Gbps PIN-TIA Receiver Module-Receptacle (5pin-out, 3.3V)
|
List of Unclassifed Man... |
T-11-1250M-R3-MFC
|
392Kb/3P |
1.25Gbps PIN-TIA Receiver Module-Receptacle
|
Source Photonics, Inc. |
T-11-1250M-R3-MFC-G5
|
397Kb/3P |
1.25Gbps PIN-TIA Receiver Module-Receptacle (5pin-out, 3.3V)
|
List of Unclassifed Man... |
T-11-1250M-R3-MFC-G5
|
392Kb/3P |
1.25Gbps PIN-TIA Receiver Module-Receptacle
|
Source Photonics, Inc. |
T-11-1250M-R3-MFC-GR
|
397Kb/3P |
1.25Gbps PIN-TIA Receiver Module-Receptacle (5pin-out, 3.3V)
|
List of Unclassifed Man... |
T-11-1250M-R3-MFC-GR
|
392Kb/3P |
1.25Gbps PIN-TIA Receiver Module-Receptacle
|
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