| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |
 National Semiconductor ... |
MTD48
|
62Kb / 1P |
48 Lead Molded Thin Shrink Small Outline Package, JEDEC
|
|
MTC16
|
70Kb / 1P |
16 Lead Molded Thin Shrink Small Outline Package, JEDEC NS Package Number MTC16
|
 STMicroelectronics |
TSSO20
|
57Kb / 4P |
20-LEAD THIN SHRINK SMALL OUTLINE
Nov-2002 |
 Maxim Integrated Produc... |
21-0136F
|
55Kb / 2P |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm
Rev F |
 fujitsu semiconductor |
FPT-20P-M04
|
37Kb / 1P |
THIN SHRINK SMALL OUTLINE PACKAGE
|
 STMicroelectronics |
TSSOP14
|
58Kb / 4P |
14-LEAD THIN SHRINK SMALL OUTLINE
Nov-2002 |
|
SO-8
|
56Kb / 5P |
8-LEAD SMALL OUTLINE PACKAGE
Feb-2005 |
 Maxim Integrated Produc... |
21-0057
|
29Kb / 1P |
PACKAGE OUTLINE, 5L SOT23
Rev G |
|
21-0141
|
104Kb / 2P |
PACKAGE OUTLINE, 36,40,48L THIN QFN, 6*6*0.75MM
Rev N |
 ACCUTEK MICROCIRCUIT CO... |
AK08D300-TSOP
|
545Kb / 5P |
Thin Small Outline Package TSOP DIP Adapters
|