| Produttore elettronici | Il numero della parte | Scheda tecnica | Spiegazioni elettronici |
 Molex Electronics Ltd. |
0440671403
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216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
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0440672403
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216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 24 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
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0440670403
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216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
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0440671203
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216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
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0440671603
|
216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 16 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
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0440672402
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216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0??Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 24 Circuits, 0.38關m (15關") Gold (Au) Selective Plating
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0440671401
|
216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
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0440670402
|
216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
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0440670401
|
216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
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0440672401
|
216Kb / 3P |
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|