MPC755 datasheet(32/56 Pages) MOTOROLA

Il numero della parte	MPC755

Spiegazioni elettronici	RISC Microprocessor Hardware Specifications

PDF	56 Pages

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Produttore elettronici	MOTOROLA [Motorola, Inc]

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MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

Package Description

7.2 Mechanical Dimensions for the MPC745 PBGA

Figure 18 provides the mechanical dimensions and bottom surface nomenclature for the MPC745, 255 PBGA

package.

Figure 18. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC745,

255 PBGA Package

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A METALIZED

FEATURE WITH VARIOUS SHAPES. BOTTOM

SIDE A1 CORNER IS DESIGNATED WITH A BALL

MISSING FROM THE ARRAY.

4. CAPACITOR PADS MAY BE UNPOPULATED.

Millimeters

DIM

Min

Max

2.25

2.80

0.50

0.70

1.00

1.20

—

0.60

0.90

21.00 BSC

6.75

21.00 BSC

7.87

1.27 BSC

0.2

A1 CORNER

0.2

0.2 C

255X

123456789 10 11 12 13 14 15 16

0.3

0.15

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