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SN74LVC2G53 Scheda tecnica(PDF) 28 Page - Texas Instruments |
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SN74LVC2G53 Scheda tecnica(HTML) 28 Page - Texas Instruments |
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28 / 31 page ![]() www.ti.com PACKAGE OUTLINE C 0.5 MAX 0.19 0.15 1.5 TYP 0.5 TYP 8X 0.25 0.21 0.5 TYP B E A D 4223082/A 07/2016 DSBGA - 0.5 mm max height YZP0008 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE BALL TYP 0.05 C B 1 2 0.015 C A B SYMM SYMM C A D SCALE 8.000 D: Max = E: Max = 1.918 mm, Min = 0.918 mm, Min = 1.858 mm 0.858 mm |
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