5

SN74LVC2G53

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SCES324P – JULY 2001 – REVISED OCTOBER 2016

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Copyright © 2001–2016, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

The package thermal impedance is calculated in accordance with JESD 51-7.

6.4 Thermal Information

SN74LVC2G53

UNIT

DCT (SM8)

DCU (VSSOP)

YZP (DSBGA)

8 PINS

8 PINS

8 PINS

220

227

102

°C/W

(1)

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MAX

UNIT

ON-state switch resistance

(see Figure 2

and Figure 1)

1.65 V

13

30

Ω

2.3 V

10

20

3 V

8.5

17

4.5 V

6.5

13

Peak ON-state resistance

(see Figure 2

and Figure 1)

1.65 V

86.5

120

Ω

2.3 V

23

30

3 V

13

20

4.5 V

8

15

Difference of ON-state resistance

between switches

(see Figure 2

and Figure 1)

1.65 V

7

Ω

2.3 V

5

3 V

3

4.5 V

2

OFF-state switch leakage current

5.5 V

±1

μA

ON-state switch leakage current

5.5 V

±1

μA

Control input current

5.5 V

±1

μA

Supply current

5.5 V

1

μA

Supply-current change

5.5 V

500

μA

Control input capacitance

5 V

3.5

pF

Switch input/output

capacitance

Y

5 V

6.5

pF

COM

10

Switch input/output capacitance

5 V

19.5

pF