V62SLASH13624-01XE-R datasheet(18/77 Pages) TI1

18 / 77 page

MSP430F2132-EP

SLAS913A – JULY 2013 – REVISED AUGUST 2013

www.ti.com

Product Folder Links: MSP430F2132-EP

Submit Documentation Feedback

(1)

Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is

applied to the TEST pin when blowing the JTAG fuse.

(3)

Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with peak

reflow temperatures not higher than classified on the device label on the shipping boxes or reels.

5 Specifications

5.1 Absolute Maximum Ratings

(1)

Voltage applied at VCC to VSS

-0.3 V to 4.1 V

Voltage applied to any pin (2)

-0.3 V to VCC + 0.3 V

Diode current at any device terminal

±2 mA

Storage temperature, Tstg

(3)

Unprogrammed device

-55°C to 150°C

Programmed device

-55°C to 150°C

See data sheet for absolute maximum and minimum recommended operating conditions.

Silicon operating life design goal is 10 years at 110°C junction temperature (does not include package interconnect

life).

The predicted operating lifetime vs. junction temperature is based on reliability modeling using electromigration as the

dominant failure mechanism affecting device wearout for the specific device process and design characteristics.

Figure 1. Operating Life Derating Chart

V62/13624-01XE-R Scheda tecnica(PDF) 18 Page - Texas Instruments