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MSM9802 Scheda tecnica(PDF) 48 Page - OKI electronic componets |
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MSM9802 Scheda tecnica(HTML) 48 Page - OKI electronic componets |
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48 / 52 page ![]() 48/51 MSM9802/03/05-xxx ¡ Semiconductor MSM9805 Pad Layout Chip size : X=3.22mm Y=5.96mm Chip thickness : 350 µm ± 30µm Pad size : 110 µm ¥ 110µm Substrate potential : GND 3 2 1 18 17 16 15 4 5 (NC) 6 7 8 9 10 11 12 14 13 Y-axis X-axis Pad Coordinates (Chip center is located at X=0 and Y=0) Pad No. Pad Name X-axis Y-axis Pad No. Pad Name X-axis Y-axis 1 I3/ (A0) –415 2777 10 VDD 452 –2723 2 I4/ (A1) –816 2777 11 OSC1 742 –2726 3 I5/ (A2) –1460 2777 12 OSC2 1349 –2726 4 RESET –1460 882 13 OSC3 1460 –1532 5 XT/CR –1458 364 14 CPU/STD 1453 267 6 NAR –1460 –1546 15 ST/(RND) 1455 1338 7 GND –1460 –2768 16 I0/(SW0) 1432 2777 8VREF –1136 –2726 17 I1/(SW1) 754 2777 9 AOUT –585 –2726 18 I2/(SW2) 312 2777 (Unit: µm) Pad name in parentheses is for stand-alone mode. |
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