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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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MSM9802 Scheda tecnica(PDF) 51 Page - OKI electronic componets |
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MSM9802 Scheda tecnica(HTML) 51 Page - OKI electronic componets |
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51 / 52 page  51/51 MSM9802/03/05-xxx ¡ Semiconductor (Unit : mm) Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). SSOP30-P-56-0.65-K Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.19 TYP. Mirror finish |
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