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ADA4625-1ARDZ-R7 Scheda tecnica(PDF) 7 Page - Analog Devices

Il numero della parte ADA4625-1ARDZ-R7
Spiegazioni elettronici  36V 18MHz Low Noise, Fast Settling Single Supply, RRO, JFET Op Amp
PDF  35 Pages
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Produttore elettronici  AD [Analog Devices]
Homepage  http://www.analog.com
Logo AD - Analog Devices

ADA4625-1ARDZ-R7 Scheda tecnica(HTML) 7 Page - Analog Devices

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Data Sheet
ADA4625-1/ADA4625-2
Rev. A | Page 7 of 35
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
Supply Voltage
40 V
Input Voltage
(V−) − 0.2 V to
(V+ ) + 0.2 V
Differential Input Voltage
(V−) − 0.2 V to
(V+) + 0.2 V
Input Current1
±20 mA
Storage Temperature Range
−65°C to +150°C
Operating Temperature Range
−40°C to +125°C
Junction Temperature Range
−65°C to +150°C
Lead Temperature, Soldering (10 sec)
300°C
Electrostatic Discharge (ESD)
Human Body Model (HBM)2
ADA4625-1
1.25 kV
ADA4625-2
1.5 kV
Field Induced Charge Device Model (FICDM)3
ADA4625-1
1.25 kV
ADA4625-2
1.25 kV
1 The input pins have clamp diodes connected to the power supply pins. Limit
the input current to 20 mA or less whenever input signals exceed the power
supply rail by 0.3 V.
2 ESDA/JEDEC JS-001-2011 applicable standard.
3 JESD22-C101 (ESD FICDM standard of JEDEC) applicable standard.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Close attention to PCB
thermal design is required.
Table 5. Thermal Resistance
Package Type1, 2
θJA3
θJC
Unit
RD-8-1
52.8
5.7
°C/W
1 Values were obtained per JEDEC standard JESD-51.
2 Although the exposed pad can be left floating, it must be connected to the
GND, or the V+ or V− plane for proper thermal management.
3 Board layout impacts thermal characteristics such as θJA. When proper thermal
management techniques are used, a better θJA can be achieved. Refer to the
Thermal Management section for additional information.
ESD CAUTION



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