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ACPF-7002 Scheda tecnica(PDF) 5 Page - Agilent(Hewlett-Packard) |
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ACPF-7002 Scheda tecnica(HTML) 5 Page - Agilent(Hewlett-Packard) |
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5 / 8 page ![]() 5 Note: Dimensions in mm Figure 10. Detailed Bottom, Side and Top view of Package Figure 11. Suggested PCB layers, viewed from top Layer 1 Layer 2 (GROUND layer) Note: Dimensions in mm 2.0 4 2 3 1.25 MAX : Pin 1 Location :WorkWeek : Lot Number Shaded Region Grounded 0.60 ± 0.15 A B,C,D Pin 1 Marking 1 0.35 ± 0.15 8X 0.61 OUT 3 IN 1 This region is Soldermask covering ground 2 1.92 0.70 0.61 Region (4) & (2) is exposed ground for soldering filter pads 4 0.30 Via to layer 2 0.33 2 0.3 0.3 Metal voided To decrease Capacitance at Input Port Metal voided To decrease Capacitance at output Port 0.3 0.3 0.3 Metal voided To decrease Capacitance at Input Port Metal voided To decrease Capacitance at output Port 0.3 |
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