TLE5014 datasheet(39/45 Pages) INFINEON

39 / 45 page

Final Datasheet

Rev. 1.0

2018-04-04

TLE5014

Package Information

The device is qualified with a MSL level of 3. It is halogen free, lead free and RoHS compliant.

7.1

Package Parameters

Tilt angle

Reference plane

Rotational

displacement

Package

Chip

Die pad

Chip

Figure 7-1 Tolerance of the die in the package

The active area of the GMR sensing element is 360µm x 470µm.

It has to be ensured that a magnet is used which has sufficient size to provide a homogeneous magnetic field

over the total sensing element area. For a practical application design this means that the magnet has to be

Table 7-1

Package Parameters

Parameter

Symbol Limit Values

Unit

Notes

Min. Typ. Max.

Thermal resistance

RthJA

150

K/W

Junction to air1)

1) according to Jedec JESD51-7

RthJC

K/W

Junction to case

RthJL

K/W

Junction to lead

Moisture Sensitively Level MSL 3

260°C2)

2) suitable for reflow soldering with soldering profiles according to JEDEC J-STD-020E (December 2014)

Lead Frame

Plating

Sn 100%

> 7 μm

Table 7-2

Position of the die in the package

Parameter

Symbol Limit Values

Unit

Notes

Min. Typ. Max.

Tilt

in respect to the z-axis and

reference plane (see

Figure 7-1),

Rotational displacement

in respect to the reference

axis (see Figure 7-1)

Placement tolerance in

package

100

µm

in x and y direction

TLE5014 Scheda tecnica(PDF) 39 Page - Infineon Technologies AG

TLE5014 Scheda tecnica(HTML) 39 Page - Infineon Technologies AG

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45

Scheda tecnica Scarica

Link URL