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Motore di ricerca datesheet componenti elettronici |
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R200 Scheda tecnica(PDF) 33 Page - Intel Corporation |
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R200 Scheda tecnica(HTML) 33 Page - Intel Corporation |
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33 / 51 page  System Integration 334616-001 33 Figure 7-9. System Component Placement 7.9.1 Thermal Limits Table 7-2. Component Case Temperature Limits Component Case Temperature Limit ΔT Junction to Case Junction Temperature (Est.) R200 Color Camera Sensor 61oC 9oC 70oC IR Camera Sensor 62oC 8oC 70oC Laser Projector † - 75°C R200 ASIC 95oC - - NOTE: † Laser projector temperature should be monitored through the R200’s embedded thermal sensor. Refer to the following section for more details. It is not possible to directly measure junction temperature of the module components. Because of this, Intel recommends taking measurements with thermal probes at the locations identified in Figure 7-10. The measurements can be correlated with the thermal model to estimate component junction temperatures. Figure 7-10. Module Thermal Probe Points |
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