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Motore di ricerca datesheet componenti elettronici |
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R200 Scheda tecnica(PDF) 36 Page - Intel Corporation |
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R200 Scheda tecnica(HTML) 36 Page - Intel Corporation |
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36 / 51 page  System Integration 36 334616-001 Figure 7-14. Module Mounting Rear Cover Table 7-5. Copper Foil Recommendation Detail Notes Material Copper Thickness 0.2mm Width 110mm (entire back side of module) Min Overlap with Module 9.5mm Table 7-6. Heat Spreader Recommendation Detail Notes Material Graphite Thickness 0.2mm Minimum Surface Area 260x80mm^2 Min Overlap With Copper Foil 10mm 7.10 Motherboard Routing Considerations The imaging module requires a dedicated XHCI USB3 port. A USB hub must not be implemented between the imaging module and XHCI USB3 port to ensure highest possible bandwidth. The routing topology is specific to the platform. If the platform the R200 is being integrated is not listed below, please contact your Intel representative for support details. Adhesive Camera Module |
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