Data Sheet

ADF5709

Rev. A | Page 9 of 9

OUTLINE DIMENSIONS

12

0.50

BSC

0.20

MIN

2.50 REF

BOTTOM VIEW

TOP VIEW

1

24

7

13

18

19

6

0.36

0.30

0.24

0.38

0.32

0.26

EXPOSED

PAD

4.05

3.90 SQ

3.75

3.10 REF

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

2.60

2.50 SQ

2.40

PIN 1

0.08

REF

SIDE VIEW

1.20

1.10

1.00

SEATING

PLANE

PIN 1

INDICATOR

AREA

Figure 18. 24-Terminal Ceramic Leadless Chip Carrier [LCC]

(E-24-2)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADF5709BEZ

−40°C to +85°C

MSL3

24-Terminal Ceramic Leadless Chip Carrier [LCC]

E-24-2

ADF5709BEZ-R7

−40°C to +85°C

MSL3

24-Terminal Ceramic Leadless Chip Carrier [LCC]

E-24-2

EV-ADF5709

Evaluation Board

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registered trademarks are the property of their respective owners.

D20685-12/20(A)