DIP34 80x33, AUTOMOTIVE MODULE

CASE MODGL

ISSUE O

DATE 19 OCT 2018

XXXX = Specific Device Code

ZZZ = Lot ID

AT

= Assembly & Test Location

Y

= Year

W

= Work Week

NNN = Serial Number

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “G”, may

or may not be present. Some products may

not follow the Generic Marking.

GENERIC

MARKING DIAGRAM*

XXXXXXXXXXX

ZZZ ATYWW

NNNNNNN

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

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98AON97156G

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

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DIP34 80x33, AUTOMOTIVE MODULE

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