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LTM4656 Scheda tecnica(PDF) 2 Page - Analog Devices

Il numero della parte LTM4656
Spiegazioni elettronici  Synchronous Boost 關Module Regulator with Input-Output Short Protection
PDF  28 Pages
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Produttore elettronici  AD [Analog Devices]
Homepage  http://www.analog.com
Logo AD - Analog Devices

LTM4656 Scheda tecnica(HTML) 2 Page - Analog Devices

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LTM4656/LTM4656-1
2
Rev. 0
For more information www.analog.com
PIN CONFIGURATION
ABSOLUTE MAXIMUM RATINGS
VIN, SENSE1, BVIN, SW, VOUT,
SHDN, UV, FLT, VBIAS................................. –0.3V to 36V
INTVCC, MODE_PLLIN, PGOOD ................... –0.3V to 6V
FREQ, SS, COMP, VFB ...........................–0.3V to INTVCC
RUN ............................................................. –0.3V to 5V
TMR......................................................................0.5mA
TEMP+, TEMP–................... <0.7V Across Pins, No More
than 5mA (Current Source)
Operating Junction Temperature (Note 2).. –40 to 125°C
Storage Temperature Range ...................... –55 to 125°C
Peak Solder Reflow Body Temperature ................. 245°C
Note: Not recommended for upside-down reflow.
(Note 1)
VIN
BVIN
VOUT
1
A
B
C
D
E
F
G
H
J
K
L
M
2
3
4
5
6
7
TOP VIEW
8
9
10
11
12
GND
GND
GND
GND
BGA PACKAGE
144-LEAD (16mm × 16mm × 7.07mm)
TJMAX = 125°C, θJA = 11.8°C/W,
θJCtop = 7.1°C/W, θJCbot = 4.4°C/W (Note 7)
WEIGHT = 4.22g
GND
GND
GND
GND
NC
SHDN
SENSE1
SW
RUN
UV
FLT
TEMP–
TEMP+
TMR
FREQ
COMP SS PGOOD VBIAS
VFB
MODE_PLLIN
INTVCC
ORDER INFORMATION
(See Capacitor Matrix, Pin Configuration Table)
PART NUMBER
PAD OR BALL FINISH
PART MARKING*
PACKAGE TYPE
MSL RATING
TEMPERATURE 
RANGE (Note 2)
DEVICE
FINISH CODE
LTM4656EY#PBF
SAC305 (RoHS)
LTM4656Y
e1
BGA
4
−40°C to 125°C
LTM4656IY#PBF
SAC305 (RoHS)
e1
−40°C to 125°C
LTM4656IY
SnPb (63/37)
e0
−40°C to 125°C
LTM4656EY-1#PBF
SAC305 (RoHS)
e1
−40°C to 125°C
LTM4656IY-1#PBF
SAC305 (RoHS)
e1
−40°C to 125°C
LTM4656IY-1
SnPb (63/37)
e0
−40°C to 125°C
• Contact the factory for parts specified with wider operating temperature
ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures
• LGA and BGA Package and Tray Drawings



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