PIMXRT406LCFP4A datasheet(1/71 Pages) NXP

Il numero della parte	PIMXRT406LCFP4A

Spiegazioni elettronici	i.MX RT1015 Crossover Processors Data Sheet for Industrial Products

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Produttore elettronici	NXP [NXP Semiconductors]

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NXP Semiconductors

Data Sheet: Technical Data

Document Number: IMXRT1015IEC

Rev. 2, 03/2021

MIMXRT1015CAF4A

Package Information

Plastic Package

100-Pin LQFP, 14 x 14 mm, 0.5 mm pitch

Ordering Information

See Table 1 on page 4

NXP reserves the right to change the production detail specifications as may be required

to permit improvements in the design of its products.

1

i.MX RT1015 introduction

The i.MX RT1015 is a processor of i.MX RT family

featuring NXP’s advanced implementation of the Arm®

Cortex®-M7 core, which operates at speeds up to 396

MHz to provide high CPU performance and real-time

response.

The i.MX RT1015 processor has 128 KB on-chip RAM,

which can be flexibly configured as TCM or

general-purpose on-chip RAM. The i.MX RT1015

integrates advanced power management module with

DCDC and LDO that reduces complexity of external

power supply and simplifies power sequencing. The

i.MX RT1015 also provides various memory interfaces,

including Quad SPI, and a wide range of connectivity

interfaces including UART, SPI, I2C, and USB; for

connecting peripherals including Bluetooth™, and GPS.

The i.MX RT1015 also has rich audio features, including

SPDIF and I2S audio interface. Various analog IP

integration, including ADC, temperature sensor, etc.

i.MX RT1015 Crossover

Processors Data Sheet

for Industrial Products

1. i.MX RT1015 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 4

2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3.1. Special signal considerations . . . . . . . . . . . . . . . 12

3.2. Recommended connections for unused analog

interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 14

4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 14

4.2. System power and clocks . . . . . . . . . . . . . . . . . . 20

4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 25

4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 31

4.5. External memory interface . . . . . . . . . . . . . . . . . 36

4.6. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

4.7. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

4.8. Communication interfaces . . . . . . . . . . . . . . . . . . 51

4.9. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 57

5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 57

5.2. Boot device interface allocation . . . . . . . . . . . . . . 57

6. Package information and contact assignments . . . . . . . 60

6.1. 14 x 14 mm package information . . . . . . . . . . . . 60

7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

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