Data Sheet

ADPA7005CHIP

Rev. 0 | Page 23 of 23

OUTLINE DIMENSIONS

Figure 65. 12-Pad Bare Die [CHIP]

(C-12-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADPA7005CHIP

−55°C to +85°C

12-Pad Bare Die [CHIP]

C-12-3

ADPA7005C-KIT

−55°C to +85°C

12-Pad Bare Die [CHIP]

C-12-3

*This die utilizes fragile air bridges. Any pickup tools used must not contact this area.

TOP VIEW

(CIRCUIT SIDE)

0.102

SIDE VIEW

3.750

1.043

0.949

3.470

*AIR BRIDGE

AREA

1.650

1.650

0.090

0.331

0.459

1.314

1.399

1

7

2

3

4

6

8

10

11

12

5

9

0.251

0.214

0.156

0.081

0.081

0.761

0.331

0.459

0.761

(Pads 2 - 4, 6, 8

and 10-12)

(Pads 1,5, 7, and 9)

0.031

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registered trademarks are the property of their respective owners.

D17319-0-2/19(0)