ADP1190AACBZ-R7 datasheet(4/12 Pages) AD

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ADP1190A

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN to GND

−0.3 V to +4.0 V

VOUT to GND

−0.3 V to VIN

Sx to GND

−0.3 V to +4.0 V

Tx to GND

−0.3 V to +4.0 V

EN to GND

−0.3 V to +4.0 V

Continuous Load Switch Current

TA = 25°C

±1 A

TA = 85°C

±500 mA

Continuous Diode Current

−50 mA

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

Operating Temperature Range

Junction Temperature Range

−40°C to +125°C

Ambient Temperature Range

−40°C to +85°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination. The ADP1190A can be damaged when the

junction temperature limits are exceeded. Monitoring ambient

temperature does not guarantee that the junction temperature (TJ)

is within the specified temperature limits. In applications with

high power dissipation and poor thermal resistance, the

maximum ambient temperature may need to be derated.

In applications with moderate power dissipation and low PCB

thermal resistance, the maximum ambient temperature can

exceed the maximum limit as long as the junction temperature

is within specification limits. The TJ of the device is dependent

on the ambient temperature (TA), the power dissipation of the

device (PD), and the junction-to-ambient thermal resistance of

the package (θJA).

Maximum TJ is calculated from TA and PD using the formula

TJ = TA + (PD × θJA)

The junction-to-ambient thermal resistance (θJA) of the package

is based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on

the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required. The value of θJA can vary, depending

on PCB material, layout, and environmental conditions. The

specified value of θJA is based on a 4-layer, 4 inch × 3 inch circuit

board. See JESD51-7 and JESD51-9 for detailed information

on the board construction. For additional information, see the

AN-617 Application Note, Wafer Level Chip Scale Package.

ΨJB is the junction-to-board thermal characterization parameter

with units of °C/W. ΨJB of the package is based on modeling and

calculation using a 4-layer board. JESD51-12, Guidelines for

Reporting and Using Electronic Package Thermal Information,

states that thermal characterization parameters are not the same

as thermal resistances. ΨJB measures the component power

flowing through multiple thermal paths rather than through a

single path as in thermal resistance (θJB). Therefore, ΨJB thermal

paths include convection from the top of the package as well as

radiation from the package, factors that make ΨJB more useful

in real-world applications. Maximum TJ is calculated from the

board temperature (TB) and PD using the formula

TJ = TB + (PD × ΨJB)

See JESD51-8 and JESD51-12 for more detailed information

about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

ΨJB

Unit

12-Ball WLCSP

130

29.2

°C/W

ESD CAUTION

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