ADP1972ARUZ-R7 datasheet(5/18 Pages) AD

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Data Sheet

ADP1972

Rev. B | Page 5 of 18

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, EN, FAULT to GND

−0.3 V to +61 V

SYNC, COMP, MODE to GND

−0.3 V to +5.5 V

DH, DL, SS, DMAX, SCFG, CL to GND

−0.3 V to VREG + 0.3 V

GNDSENSE to GND

−0.3 V to +0.3 V

Operating Ambient Temperature Range

−40°C to +85°C

Junction Temperature

125°C

Storage Temperature Range

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Absolute maximum ratings apply individually only, not in

combination.

THERMAL OPERATING RANGES

The ADP1972 can be damaged when the junction temperature

limits are exceeded. The maximum operating junction

temperature (TJ MAX) takes precedence over the maximum

operating ambient temperature (TA MAX). Monitoring ambient

temperature does not guarantee that the junction temperature

(TJ) is within the specified temperature limits.

In applications with high power dissipation and poor printed

circuit board (PCB) thermal resistance, the maximum ambient

temperature may need to be derated. In applications with

moderate power dissipation and low PCB thermal resistance,

the maximum ambient temperature can exceed the maximum

limit when the junction temperature is within specification

limits.

The junction temperature (TJ) of the device is dependent on the

ambient temperature (TA), the power dissipation of the device (PD),

and the junction to ambient thermal resistance of the package (θJA).

Use the following equation to calculate the maximum junction

temperature (TJ) from the ambient temperature (TA) and power

dissipation (PD):

TJ = TA + (PD × θJA)

(1)

For additional information on thermal resistance, refer to

Application Note AN-000, Thermal Characteristics of IC

Assembly.

ESD CAUTION

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