MCIMX503CVM8B datasheet(116/136 Pages) NXP

Il numero della parte	MCIMX503CVM8B

Spiegazioni elettronici	i.MX50 Applications Processors for Consumer Products

PDF	136 Pages

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Produttore elettronici	NXP [NXP Semiconductors]

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i.MX50 Applications Processors for Consumer Products, Rev. 7

Package Information and Contact Assignments

Freescale Semiconductor

116

5.3

17 x 17 mm, 0.8 mm Pitch, 400 Pin MAPBGA Package Information

This section contains the outline drawing, signal assignment map, ground, power, reference ID (by ball

grid location) for the 17 x 17 mm, 0.8 mm pitch, 400 pin MAPBGA package.

VDD2P5

AD4

—

VDD3P0

AD3

—

VDDA

P17, R17

—

VDDAL1

P15, R15

—

VDDGP

G10, G8, G9, H10, H7, H8, H9, J7, J8, K10, K7, K8, L10,

L7, L8

—

VDDO25

N23

—

VSS

A1, A24, AA11, AA18, AA2, AA9, AC18, AC3, AC4, AC6,

AC7, AD1, AD18, AD24, E17, E18, E21, E8, E9, F21,

G11, G12, G13, G21, G23, H11, H12, H13, K11, K12,

K13, L11, L12, L13, L14, L17, M11, M14, M15, M17, N11,

N14, N15, N17, P11, P12, P13, P14, R11, R12, R13,

R14, T17, U12, U13, U14, U15, U16, U17

—

Table 82. 416 PoPBGA 13 x 13 mm Ground, Power, Sense, and Reference Contact Signals (continued)

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