www.ti.com

EXAMPLE BOARD LAYOUT

(R0.05) TYP

10X (0.5)

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

(2.6)

(3.8)

12X (0.25)

12X (0.6)

(3)

(

0.2) VIA

TYP

(1.25)

(1.05)

WSON - 0.8 mm max height

DNT0012B

PLASTIC SMALL OUTLINE - NO LEAD

4214928/C 10/2021

SYMM

1

6

7

12

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

EXPOSED METAL