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OPA593 Scheda tecnica(PDF) 3 Page - Texas Instruments |
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OPA593 Scheda tecnica(HTML) 3 Page - Texas Instruments |
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3 / 23 page ![]() 5 Pin Configuration and Functions 1 E/D Com 12 E/D 2 NC 11 ILIMIT 3 –IN 10 V+ 4 +IN 9 OUT 5 NC 8 Thermal Flag 6 V– 7 Current Flag Not to scale Thermal Pad Figure 5-1. DNT (12-Pin WSON) Package, Top View Table 5-1. Pin Functions PIN TYPE DESCRIPTION NAME NO. Current Flag 7 Output Overcurrent status flag E/D 12 Input Enable and disable E/D Com 1 Input Enable and disable common ILIMIT 11 Input Current limit +IN 4 Input Noninverting input –IN 3 Input Inverting input NC 2, 5 — No internal connection OUT 9 Output Output Thermal Flag 8 Output Overtemperature status flag Thermal Pad Thermal pad — The thermal pad is internally connected to V–. The thermal pad must be soldered to a printed-circuit board (PCB) connected to V–, even with applications that have low power dissipation. V+ 10 Power Positive (highest) power supply V– 6 Power Negative (lowest) power supply www.ti.com OPA593 SBOS659A – JANUARY 2022 – REVISED MARCH 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: OPA593 |
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