MIC5321

DS20006678A-page 18



2022 Microchip Technology Inc. and its subsidiaries

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

6-Lead Very, Very Thin Dual Flat, No Lead Package (K3A) - 1.6x1.6x0.8 mm Body [WDFN]

With 1.26x0.5 mm Exposed Pad; Micrel Legacy Package Code DFN1616-6LD-PL-1

Microchip Technology Drawing C04-1015 Rev A

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

A3

e

L

E

N

0.50 BSC

0.203 REF

0.45

0.30

0.20

0.70

0.00

0.25

0.35

0.50

0.75

0.02

1.60 BSC

MILLIMETERS

MIN

NOM

6

0.55

0.40

0.30

0.80

0.05

MAX

K–

0.20

–

Terminal-to-Exposed-Pad

Overall Length

Exposed Pad Length

D

D2

1.21

1.60 BSC

1.26

1.31