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2022 Microchip Technology Inc. and its subsidiaries

DS20006678A-page 19

MIC5321

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Center Pad Width

Center Pad Length

Contact Pitch

Y2

X2

0.30

1.30

MILLIMETERS

0.50 BSC

MIN

E

MAX

Contact Pad Length (X6)

Contact Pad Width (X6)

Y1

X1

1.30

0.30

NOM

C0

7

.

1

g

n

i

c

a

p

S

d

a

P

t

c

a

t

n

o

C

Contact Pad to Contact Pad (X4)

G2

0.20

Thermal Via Diameter

V

0.30

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Contact Pad to Center Pad (X6)

G1

0.25

Microchip Technology Drawing C04-3015 Rev A

C

E

X1

Y1

Y2

X2

G2

G1

ØV

SILK SCREEN

1

2

N

6-Lead Very, Very Thin Dual Flat, No Lead Package (K3A) - 1.6x1.6x0.8 mm Body [WDFN]

With 1.26x0.5 mm Exposed Pad; Micrel Legacy Package Code DFN1616-6LD-PL-1