AD9744ACP-PCBZ datasheet(6/32 Pages) AD

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AD9744

Data Sheet

Rev. C | Page 6 of 32

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

With

Respect to

Min

Max

Unit

AVDD

ACOM

−0.3

+3.9

DVDD

DCOM

−0.3

+3.9

CLKVDD

CLKCOM

−0.3

+3.9

ACOM

DCOM

−0.3

+0.3

ACOM

CLKCOM

−0.3

+0.3

DCOM

CLKCOM

−0.3

+0.3

AVDD

DVDD

−3.9

+3.9

AVDD

CLKVDD

−3.9

+3.9

DVDD

CLKVDD

−3.9

+3.9

CLOCK, SLEEP

DCOM

−0.3

DVDD + 0.3

Digital Inputs,

MODE

DCOM

−0.3

DVDD + 0.3

IOUTA, IOUTB

ACOM

−1.0

AVDD + 0.3

REFIO, REFLO, FS

ADJ

ACOM

−0.3

AVDD + 0.3

CLK+, CLK−,

CMODE

CLKCOM

−0.3

CLKVDD +

0.3

Junction

Temperature

150

°C

Storage

Temperature

−65

+150

°C

Lead Temperature

(10 sec)

300

°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

Thermal impedance measurements were taken on a 4-layer

board in still air, in accordance with EIA/JESD51-7.

Table 5. Thermal Resistance

Package Type

θJA

Unit

28-Lead 300-Mil SOIC

55.9

°C/W

28-Lead TSSOP

67.7

°C/W

32-Lead LFCSP

32.5

°C/W

ESD CAUTION

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