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STM32G081EB Scheda tecnica(PDF) 111 Page - STMicroelectronics

Il numero della parte STM32G081EB
Spiegazioni elettronici  Arm® Cortex®-M0 32-bit MCU, 128 KB Flash, 36 KB RAM,4x USART, timers, ADC, DAC, comm. I/Fs, AES, RNG, 1.7-3.6V
PDF  136 Pages
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Produttore elettronici  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32G081EB Scheda tecnica(HTML) 111 Page - STMicroelectronics

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DS12231 Rev 4
111/136
STM32G081xB
Package information
130
Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
The printed markings may differ depending on the supply chain.
Other optional marking or inset/upset marks that identify the parts throughout supply chain
operations, are not indicated below.
Figure 34. WLCSP25 package marking example
1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified
and therefore not approved for use in production. ST is not responsible for any consequences resulting
from such use. In no event will ST be liable for the customer using any of these engineering samples in
production. ST's Quality department must be contacted prior to any decision to use these engineering
samples to run a qualification activity.
Table 75. Recommended PCB pad design rules for WLCSP25 package
Dimension
Recommended value (mm)
Pitch
0.4
Dpad
225
Dsm
0.290 typ.(1)
1. Depends on the solder mask registration tolerance
Stencil opening
0.250
Stencil thickness
0.100
MSv47936V2
Product identification
(1)
Date code
Revision code
G08B6
R
YWW
Ball A1 identifier



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