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BT815Q-R Scheda tecnica(PDF) 57 Page - Bridgetek Pte Ltd. |
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BT815Q-R Scheda tecnica(HTML) 57 Page - Bridgetek Pte Ltd. |
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57 / 64 page ![]() Copyright © Bridgetek Pte Ltd 57 BT81X (815/6) Advanced Embedded Video Engine Datasheet Version 1.0 Document No.: BRT_000220 Clearance No.: BRT#126 8.2 VQFN-64 Package Dimensions A A1 A3 b D E D2 E2 e L K MIN. 0.80 0.00 0.18 7.25 7.25 0.35 0.20 NOM. 0.85 0.02 0.20 0.25 9.00 9.00 7.30 7.30 0.50 0.40 MAX. 0.90 0.05 0.30 7.35 7.35 0.45 All dimensions are in millimetres (mm) Figure 8-1 VQFN-64 Package Dimensions 8.3 Solder Reflow Profile The recommended solder reflow profile for the package is shown in Figure 8-2. Figure 8-2 BT815/6 Solder Reflow Profile The recommended values for the solder reflow profile are detailed in Figure 8-2. Values are shown for both a completely Pb free solder process (i.e. the BT815/6 is used with Pb free solder), and for a non-Pb free solder process (i.e. the BT815/6 is used with non-Pb free solder). Critical Zone: when T is in the range T to T Time, t (seconds) 25 P T = 25º C to T tp Tp TL t Preheat S t L Ramp Up L p Ramp Down T Max S T Min S |
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