183 CPHT

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Vishay BCcomponents

Revision: 04-Feb-2021

2

Document Number: 28434

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Fig. 2 - Dimensional outline

Table 1

Table 2

MOUNTING

The capacitors are designed for automatic placement on to

printed-circuit boards.

Optimum dimensions of soldering pads depend amongst

others on soldering method, mounting accuracy, print

layout and / or adjacent components.

For recommended soldering pad dimensions, refer to Fig. 3

and Table 3.

SOLDERING

Soldering conditions are defined by the curve, temperature

versus time, where the temperature is that measured on the

component during processing.

For maximum conditions refer to Fig. 4.

Any temperature versus time curve which does not exceed

the specified maximum curves may be applied.

As a general principle, temperature and duration shall be the

minimum necessary required to ensure good soldering

connections. However, the specified maximum curves

should never be exceeded.

DIMENSIONS in millimeters AND MASS

NOMINAL CASE SIZE

L x W x H

CASE

CODE

LMAX.

WMAX.

HMAX.

Ø D

BMAX.

SL1MAX.

MASS

(g)

5.0 x 5.0 x 5.8

0506

5.5

5.5

6.1

5.0

0.8

1.4

6.1

0.2

6.3 x 6.3 x 5.8

0606

6.7

6.7

6.1

6.3

0.8

2.2

7.4

0.3

6.3 x 6.3 x 7.7

0608

6.7

6.7

8.0

6.3

0.8

2.2

7.4

0.4

8.0 x 8.0 x 10.5

0810

8.5

8.5

10.8

8.0

1.1

3.1

9.2

0.9

10.0 x 10.0 x 10.5

1010

10.5

10.5

10.8

10.0

1.1

4.5

11.2

1.2

TAPE AND REEL DIMENSIONS in millimeters, PACKAGING QUANTITIES

NOMINAL CASE SIZE

L x W x H

CASE

CODE

PITCH

P1

TAPE WIDTH

W

TAPE

THICKNESS

T2

REEL DIAMETER

PACKAGING

QUANTITY

PER REEL

5.0 x 5.0 x 5.8

0506

12

12

6.1

380

1000

6.3 x 6.3 x 5.8

0606

12

16

5.7

380

1000

6.3 x 6.3 x 7.7

0608

12

16

8.0

380

900

8.0 x 8.0 x 10.5

0810

16

24

11.0

380

500

10.0 x 10.0 x 10.5

1010

16

24

11.0

380

500

2-pin:

W

MAX.

S

L

MAX.

B

Negative

polarity

H

MAX.

MAX. 0.3

D

L1

MAX.