183 CPHT

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Vishay BCcomponents

Revision: 04-Feb-2021

3

Document Number: 28434

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Fig. 3 - Recommended soldering pad dimensions

Table 3

SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS

Fig. 4 - Maximum temperature load during reflow soldering

Table 4

Note

• Temperature measuring point on top of the case and on terminals

RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters

NOMINAL CASE SIZE

L x W x H

CASE CODE

a

b

c

5.0 x 5.0 x 5.8

0506

3.0

1.6

1.4

6.3 x 6.3 x 5.8

0606

3.5

1.6

2.1

6.3 x 6.3 x 7.7

0608

3.5

1.6

2.1

8.0 x 8.0 x 10.5

0810

4.2

1.9

2.8

10.0 x 10.0 x 10.5

1010

4.4

1.9

4.3

REFLOW SOLDERING CONDITIONS for MAL2183xxxxxE3

PROFILE FEATURES

Ø

≤ 6.3 mm

Ø

≥ 8 mm

Maximum time between 150 °C to 200 °C (t1)

120 s

120 s

Ramp up rate from 217 °C to Tpeak

0.5 K/s to 3 K/s

Maximum time above 200 °C (t2)

70 s

70 s

Maximum time above 230 °C (t3)

30 s

30 s

Peak temperature TPeak

260 °C

260 °C

245 °C

Maximum reflow cycles

2

1

2

Ramp down rate Tpeak to 217 °C

6 K/s max.

Time 25 °C to TPeak

8 min max.

aa

c

b

Time (s)

Peak temperature

180

150

200

230

(°C)

T

peak

Preheat

t

1

t

2

t

3