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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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ST25DV64K Scheda tecnica(PDF) 150 Page - STMicroelectronics |
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ST25DV64K Scheda tecnica(HTML) 150 Page - STMicroelectronics |
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150 / 197 page  10.3 UFDFN8 package information UFDFPN8 is an 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package. Figure 82. UFDFN8 - Outline Top view Pin #1 ID marking Side view Seating plane eee ccc C C C C C B A 1 2 N D E aaa aaa A A1 A3 2x 2x Datum A Terminal tip Detail “A” Even terminal L1 L3 L e e/2 Pin #1 ID marking Bottom view See Detail “A” e e 1 2 ND-1 x D2 L1 L3 E2 K L b 1. Max. package warpage is 0.05 mm. 2. Exposed copper is not systematic and can appear partially or totally according to the cross section. 3. Drawing is not to scale. ST25DV04K ST25DV16K ST25DV64K UFDFN8 package information DS10925 - Rev 11 page 150/197 |
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