ST25DV64K datasheet(182/197 Pages) STMICROELECTRONICS

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Revision history

Table 298. Document revision history

Date

Revision

Changes

23-Feb-2017

Initial release.

20-Sep-2017

Updated:

•

Features

•

Section 4 Memory management

•

Section 5 ST25DVxxx specific features

•

Section 5.6.4 System memory protection

•

Section 6.4.2 I2C Sequential write

•

Section 6 I2C operation

•

Section 7 RF operation

•

Section 9.1 Maximum ratings

•

Table 158. Get System Info response format Error_flag is NOT set

•

Table 242. Absolute maximum ratings

•

Table 244. AC test measurement conditions

•

Table 246. I2C DC characteristics (up to 85 °C)

•

Table 248. I2C AC characteristics (up to 85 °C)

•

Table 250. GPO DC characteristics up to 85°C

•

Table 253. RF characteristics

•

Table 254. Operating conditions

•

Table 256. TSSOP8 – Mechanical data

•

Table 261. Ordering information scheme

•

Figure 30. I2C Present Password Sequence

•

Figure 31. I2C Write Password Sequence

•

Figure 80. TSSOP8 – Outline

Added Table 159. Memory size, Table 243. I2C operating conditions, Table 247. I2C DC characteristics (up

to 125 °C), Table 249. I2C AC characteristics (up to 125 °C), and Table 251. GPO DC characteristics up to

125°C.

04-Oct-2017

Updated Features and Section 10 Package information.

Added NFC certified logo.

19-Dec-2017

Added:

•

Figure 4. 10-ball WLCSP package: connections with CMOS Interrupt output (GPO)

•

Section 10.5 WLCSP10 package information

•

Table 259. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale mechanical data

•

Figure 84. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale package outline

•

Figure 85. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale recommended

footprint

Updated Features, Section 1 Description, Section 2.5 Energy harvesting analog output (V_EH),

Section 5.3.2 Energy harvesting feature description, Section 6.4.1 I2C Byte write, and Section 6.4.2 I2C

Sequential write.

Updated Figure 21. Arbitration between RF and I2C.

Updated Table 242. Absolute maximum ratings, Table 243. I2C operating conditions, and Table 261. Ordering

information scheme.

Deleted Device summary.

14-Jun-2018

Updated:

•

Table 21. MB_LEN_Dyn

•

Section 5.1.2 Fast transfer mode usage, Section 5.6.2 Passwords and security sessions,

Section 7.6.2 Command codes list, Section 7.6.35 Write Password, and Section 10.5 WLCSP10

package information

•

Figure 84. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale package

outline and Figure 85. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale

recommended footprint

Added Table 260. WLCSP10 recommended PCB design rules.

ST25DV04K ST25DV16K ST25DV64K

DS10925 - Rev 11

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