Feature

Description

• DDR3, DDR3L, DDR2, LPDDR2 (on 10M16, 10M25, 10M40, and 10M50.)

• SRAM (Hardware support only)

Note: For 600 Mbps performance, –6 device speed grade is required.

Performance varies according to device grade (commercial, industrial, or

automotive) and device speed grade (–6 or –7). Refer to the Intel MAX

10 FPGA Device Datasheet or External Memory Interface Spec Estimator

for more details.

Configuration

• Internal configuration

• JTAG

• Advanced Encryption Standard (AES) 128-bit encryption and compression

options

• Flash memory data retention of 20 years at 85 °C

Flexible power supply schemes

• Single- and dual-supply device options

• Dynamically controlled input buffer power down

• Sleep mode for dynamic power reduction

Intel MAX 10 Device Ordering Information

Figure 1.

Sample Ordering Code and Available Options for Intel MAX 10 Devices

V, Y : Wafer-Level Chip Scale (WLCSP)

E

: Plastic Enhanced Quad Flat Pack (EQFP)

M : Micro FineLine BGA (MBGA)

U : Ultra FineLine BGA (UBGA)

F

: FineLine BGA (FBGA)

Family Signature

Package Type

WLCSP Package Type

36 : 36 pins, 3 mm x 3 mm

81 : 81 pins, 4 mm x 4 mm

EQFP Package Type

144 : 144 pins, 22 mm x 22 mm

UBGA Package Type

169 : 169 pins, 11 mm x 11 mm

324 : 324 pins, 15 mm x 15 mm

FBGA Package Type

256 : 256 pins, 17 mm x 17 mm

484 : 484 pins, 23 mm x 23 mm

672 : 672 pins, 27 mm x 27 mm

MBGA Package Type

153 : 153 pins, 8 mm x 8 mm

Package Code

180 : 180 pins, 6 mm x 5 mm

Operating Temperature

FPGA Fabric

Speed Grade

Optional Suffix

Indicates specific device

options or shipment method

6 (fastest)

7

8

10M 16

DA U 484 I 7 G

Feature Options

02 : 2K logic elements

04 : 4K logic elements

08 : 8K logic elements

16 : 16K logic elements

25 : 25K logic elements

40 : 40K logic elements

50 : 50K logic elements

Member Code

10M : Intel® MAX® 10

G : RoHS6

ES : Engineering sample

P

: Leaded package

C

: Commercial (T = 0° C to 85° C)

I

: Industrial (T = - 40° C to 100° C)

A : Automotive (T = - 40° C to 125° C)

J

J

J

Note:

(1) DD OPN available only on 10M40 and 10M50 devices with F256, F484, and F762 packages.

SC : Single supply - compact features

SA : Single supply - analog and flash features with

RSU option

SL : Single supply - flash features with RSU option

DC : Dual supply - compact features

DF : Dual supply - flash features with RSU option

DA : Dual supply - analog and flash features with

RSU option

DD : Dual supply - analog and flash features with

RSU option and flash access control (1)

Note:

The –A6 speed grade of the Intel MAX 10 FPGA devices is not available by default in

the Intel Quartus Prime software. Contact your local Intel sales representatives for

support.

Intel® MAX® 10 FPGA Device Overview

683658 | 2021.11.01

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Intel® MAX® 10 FPGA Device Overview

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