Motore di ricerca datesheet componenti elettronici
  Italian  ▼
ALLDATASHEETIT.COM

X  

BAS321 Scheda tecnica(PDF) 3 Page - Nexperia B.V. All rights reserved

Il numero della parte BAS321
Spiegazioni elettronici  General purpose diode
PDF  10 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Produttore elettronici  NEXPERIA [Nexperia B.V. All rights reserved]
Homepage  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

BAS321 Scheda tecnica(HTML) 3 Page - Nexperia B.V. All rights reserved

  BAS321 Datasheet HTML 1Page - Nexperia B.V. All rights reserved BAS321 Datasheet HTML 2Page - Nexperia B.V. All rights reserved BAS321 Datasheet HTML 3Page - Nexperia B.V. All rights reserved BAS321 Datasheet HTML 4Page - Nexperia B.V. All rights reserved BAS321 Datasheet HTML 5Page - Nexperia B.V. All rights reserved BAS321 Datasheet HTML 6Page - Nexperia B.V. All rights reserved BAS321 Datasheet HTML 7Page - Nexperia B.V. All rights reserved BAS321 Datasheet HTML 8Page - Nexperia B.V. All rights reserved BAS321 Datasheet HTML 9Page - Nexperia B.V. All rights reserved Next Button
Zoom Inzoom in Zoom Outzoom out
 3 / 10 page
background image
Nexperia
BAS321
General purpose diode
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VRRM
repetitive peak reverse
voltage
-
250
V
VR
reverse voltage
-
200
V
IF
forward current
[1]
-
250
mA
tp = 10 ms; square wave; Tj(init) = 25 °C
-
1.7
A
tp = 1 µs; square wave; Tj(init) = 25 °C
-
9
A
IFSM
non-repetitive peak
forward current
tp = 100 µs; square wave; Tj(init) = 25 °C
-
3
A
IFRM
repetitive peak forward
current
tp ≤ 0.5 ms; δ ≤ 0.25
-
625
mA
Ptot
total power dissipation
Tamb = 25 °C
[1]
-
300
mW
Tj
junction temperature
-
150
°C
Tstg
storage temperature
-65
150
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
[1]
-
-
366
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
[2]
-
-
130
K/W
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
[2] Soldering point of cathode tab.
BAS321
All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2022. All rights reserved
Product data sheet
1 July 2022
3 / 10



Html Pages

1 2 3 4 5 6 7 8 9 10


Scheda tecnica Scarica

Go To PDF Page


Link URL



Lei ha avuto il aiuto da alldatasheet?  [ DONATE ] 

Di alldatasheet   |   Richest di pubblicita   |   contatti   |   Privacy Policy   |   Collegamento alla scheda tecnica    |   scambio Link   |   Ricerca produttore
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com