Nexperia

BAS321

General purpose diode

13. Soldering

0.95

1.65

2.2

2.1

3.05

solder lands

solder resist

occupied area

solder paste

0.5

(2×)

0.6

(2×)

0.6 (2×)

0.5 (2×)

sod323_fr

Dimensions in mm

Fig. 9. Reflow soldering footprint for SOD323

1.5 (2×)

2.9

5

1.2

(2×)

2.75

sod323_fw

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

Fig. 10. Wave soldering footprint for SOD323

BAS321

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Nexperia B.V. 2022. All rights reserved

Product data sheet

1 July 2022

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