NO.

PQ29-101ER

Product Specification and Approval Sheet Version 1 Page 4/4

Designed and manufactured by Fuzetec Technology Co., Ltd., offered by RFE International, Inc.

NOTE : Specification subject to change without notice.

2021/03/25

9. Pad Layouts、Solder Reflow and Rework Recommendations

The dimension in the table below provide the recommended pad layout for each FSMD0805 device

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp) 3 ℃/second max.

Preheat:

Temperature Min (Tsmin)

Temperature Max (Tsmax)

Time (tsmin to tsmax)

150 ℃

200 ℃

60-180 seconds

Time maintained above:

Temperature(TL)

Time (tL)

217 ℃

60-150 seconds

Peak/Classification Temperature(Tp) : 260 ℃

Time within 5℃ of actual Peak:

Temperature (tp)

20-40 seconds

Ramp-Down Rate:

6 ℃/second max.

Time 25 ℃ to Peak Temperature:

8 minutes max.

Note 1: All temperatures refer to of the package,

measured on the package body surface.

Reflow Profile

Pad dimensions (millimeters)

Device

A

Nominal

B

Nominal

C

Nominal

All 0805 Series

1.20

1.00

1.50

Solder reflow

※

Due to “Lead Free” nature, Temperature and

Dwelling time for the soldering zone is higher

than those for Regular. This may cause

damage to other components.

1. Recommended max paste thickness is

0.25mm.(Nominal)

2. Devices can be cleaned using standard

methods and aqueous solvent.

3. Rework use standard industry practices.

4. Storage Environment: < 30℃ / 60%RH

Caution:

1. If reflow temperatures exceed the

recommended profile, devices may not meet

the performance requirements.

2. Devices are not designed to be wave soldered

to the bottom side of the board.