LE B P1MS

DATASHEET

DATASHEET

12 | Version 0.1 | 2022-09-26

Recommended Solder Pad 7)

For protection during reflow soldering and handling a foil is attached to the device. The foil has to be removed before opera-

tion. For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. To ensure a

high solder joint reliability and to minimize the risk of solder joint cracks, the customer is responsible to evaluate the combina-

tion of PCB board and solder paste material for his application.